LEEM

  The LEEM in action     One of the special facilities here at the University of Wisconsin is the Wisconsin Low Energy Electron Microscopy Center, or the “LEEM” for short. We take advantage of the microscope’s capability of imaging surfaces at high temperature (greater than 1000 °C if desired) to study in-situ and in real-time the deposition of various materials at the atomic level.

 

 
         
  In many ways, this type of microscope is very similar to its higher-energy, and more common, cousin, the Transmission Electron Microscope (TEM). Both machines employ an electron gun and a set of condensor lenses to direct a parallel beam of electrons onto the desired specimen. After interacting with the specimen, the electrons pass through an objective lens, a series of apertures, and finally a set of projector lenses to magnify the image originally produced by the objective lens. With lenses arranged in this way and steering coils placed in appropriate locations along the beam path, both a LEEM and TEM can perform electron diffraction and bright- and dark-field imaging.  (Click here to see a schematic of the electron optical paths.)  
         
 

 

 

 

 

To see some of the other interesting things we are doing, visit the following:

MRSEC

IRG #1

 

Obviously, differences exist between the two microscopes.  The important distinction is in the electron energy used for imaging. A TEM uses electrons with energies on the order of 100,000 eV or greater to acquire an image, sending electrons through a specimen to yield information about bulk, or 3-D, properties. LEEM instead uses electron energies on the order of only a few eV (typically about 3-10 eV) for imaging, “reflecting” electrons off the first few atomic layers of the specimen surface, providing 2-D information. This electron reflection in turn leads to another major difference: a LEEM has an objective lens and a section of beam path through which electrons travel in anti-parallel directions.  To be capable of image magnification, a LEEM must be able to separate these “incoming” and “outgoing” beams; this is accomplished by passing the beams through the same uniform magnetic field which, in the Wisc-LEEM, bends the beams 120°. In a TEM, though, the imaging electrons simply pass through a column unidirectionally with no separation required.  
         
  What makes this microscopy technique so powerful and exciting is that we can view the deposition of materials in real-time with a vertical resolution of a single atomic layer and a lateral resolution of about 150 Å. We can therefore determine many thermodynamic, kinetic, and morphological characteristics of growth in-situ at temperature. Previous techniques were limited to “archeological” studies in which the data had to be taken after the growth process at much different temperatures.  
         
  Ongoing studies include the investigation of growth of GaN surfaces, as well as various silicon and Silicon-on-insulator surfaces before, during, and after growth of silicon and germanium. Please visit our other sites to learn about some of the interesting things we’ve found lately.  
         

 

 

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Last Updated: May 5, 2002
Page Created: May 5, 2002

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